Industrial / Heat Sinks
SRQ-XJ-16
The SRQ-XJ-16 heat sink is built for applications requiring a balance between thermal performance and minimal board real estate, with a footprint suited to mid-range power semiconductors. Its fin geometry is optimized for moderate forced-air velocities commonly found in fan-cooled enclosures. Used in telecom power equipment, industrial routers, and embedded computing platforms.
Key Features
- Compact footprint optimized for board space-constrained applications requiring thermal management
- Balanced thermal resistance profile delivers effective cooling without excessive PCB area consumption
- Low-profile design maintains compatibility with standard board-to-board clearance requirements
- Extruded aluminum construction provides reliable thermal performance in high-volume production
- Compatible with clip, screw, and adhesive mounting methods for assembly flexibility
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-16 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Space-efficient MOSFET cooling in compact switching regulator modules
Thermal management of power ICs in high-density industrial I/O boards
Low-profile heat dissipation in slim-form-factor embedded computing hardware
Compact power stage cooling in space-constrained motor driver PCBs
Minimal-footprint thermal relief for power devices in handheld industrial devices
Frequently Asked Questions
How does the SRQ-XJ-16 balance thermal performance with minimal board real estate?
The SRQ-XJ-16 uses an optimized fin pitch and base thickness ratio to extract maximum thermal performance from a reduced footprint. The design prioritizes vertical heat spreading and fin efficiency, delivering competitive thermal resistance values relative to its base area compared to larger heat sink profiles.
What is the minimum PCB clearance required around the SRQ-XJ-16?
Minimum clearance depends on fin height and the selected mounting method. CZT recommends maintaining at least 3mm lateral clearance from adjacent components to avoid restricting convective airflow into the fin channels. Refer to the dimensional drawing for exact keep-out zone specifications.
Is the SRQ-XJ-16 appropriate for reflow soldering processes?
The SRQ-XJ-16 aluminum body is not reflow-compatible. For SMD power devices, the heat sink should be attached post-reflow using clip mounting or thermal adhesive. This prevents heat sink thermal mass from interfering with solder joint formation during the reflow profile.
SRQ-XJ-16 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.