Industrial / Heat Sinks
SRQ-XJ-23
The SRQ-XJ-23 is a compact industrial heat sink designed for space-constrained PCB and chassis-mount applications. The anodized aluminum body resists corrosion while maintaining effective heat transfer from attached components. Frequently specified in telecom power modules, battery management systems, and embedded industrial controllers.
Key Features
- Compact form factor designed for space-constrained PCB and chassis-mount applications
- Low-profile fin array delivers effective cooling within tight height envelopes
- Lightweight aluminum construction minimizes added mass on PCB-mounted components
- Clip and screw mounting options for fast, reliable assembly on production lines
- Suitable for TO-220, TO-263, and similar surface-mount power device packages
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-23 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
PCB-mounted power regulator and linear IC cooling
Space-constrained industrial controller thermal management
Heat dissipation for TO-220 devices in dense PCB layouts
Compact power supply module cooling in embedded systems
Thermal management in handheld and portable industrial instruments
Frequently Asked Questions
What package types is the SRQ-XJ-23 designed to cool?
The SRQ-XJ-23 is optimized for common PCB-mount power packages including TO-220, TO-263 (D2PAK), and similar leaded or surface-mount devices. Its compact footprint and low profile make it ideal for dense PCB layouts where standard full-size heat sinks cannot be accommodated.
How is the SRQ-XJ-23 attached to PCB-mounted components?
The SRQ-XJ-23 supports both clip-on and screw-mount attachment methods. Clip mounting enables tool-free assembly and is suitable for lower-power applications, while screw mounting provides more consistent clamping force and lower contact resistance for higher dissipation requirements.
What is the maximum power dissipation the SRQ-XJ-23 can handle in still air?
Exact dissipation capacity depends on thermal resistance and allowable junction temperature rise. Compact heat sinks in this class typically achieve 5–15 W in natural convection depending on fin geometry and ambient conditions. Contact CZT with your device's power dissipation and θjc for a complete thermal budget analysis.
SRQ-XJ-23 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.