Industrial / Heat Sinks
SRQ-HJ-11-2
The SRQ-HJ-11-2 (SRQ-HJ-11-2) is a precision-engineered industrial heat sink designed for effective thermal management in power electronics and control systems. Featuring a fin-array construction optimized for natural or forced-air convection, it dissipates heat efficiently from high-power semiconductors, motor drivers, and industrial PCBs. RoHS compliant and manufactured to tight dimensional tolerances, the SRQ-HJ-11-2 is well suited for automation equipment, inverters, and embedded computing platforms where reliable junction temperature control is critical.
Key Features
- Precision-machined aluminum base ensures uniform contact with component mounting surface
- Optimized fin geometry maximizes surface area for passive convective cooling
- Anodized finish improves emissivity and corrosion resistance in industrial environments
- Compact form factor compatible with standard PCB mounting hole patterns
- Low thermal resistance design suitable for continuous-duty power dissipation
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-11-2 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling TO-220 and TO-247 packaged power transistors
Thermal management of industrial motor drive modules
Heat dissipation for DIN-rail mounted control electronics
PCB-mounted voltage regulator thermal stabilization
Passive cooling in sealed industrial enclosures
Frequently Asked Questions
What package types is the SRQ-HJ-11-2 compatible with?
The SRQ-HJ-11-2 is designed primarily for TO-220, TO-247, and similar leaded power packages. The mounting base geometry and hole spacing conform to standard footprints, allowing direct attachment without custom brackets or adapters.
Does the SRQ-HJ-11-2 require thermal interface material?
Yes. Applying a thermal interface material such as thermal paste or a phase-change pad between the component and heat sink base is strongly recommended. This eliminates air gaps and can reduce junction-to-ambient thermal resistance by 15–30% depending on surface finish quality.
Is forced-air cooling compatible with this heat sink?
The SRQ-HJ-11-2 supports both passive and forced-air cooling. Adding a low-speed fan across the fin array significantly reduces thermal resistance, making it suitable for higher power dissipation scenarios beyond its passive rating.
SRQ-HJ-11-2 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.