Industrial / Heat Sinks
SRQ-HJ-13
The SRQ-HJ-13 (SRQ-HJ-13) is a compact industrial heat sink designed to provide efficient passive cooling for medium-power electronic components. Its closely spaced fin structure promotes laminar airflow and maximizes heat dissipation per unit footprint, making it suitable for mounting directly onto voltage regulators, rectifier bridges, and switching transistors. The SRQ-HJ-13 is RoHS compliant and commonly deployed in industrial power supplies, servo amplifiers, and embedded control modules.
Key Features
- Compact low-profile design suited for space-constrained PCB assemblies
- Efficient passive cooling for medium-power semiconductor devices
- Extruded aluminum construction provides consistent fin pitch and base thickness
- Lightweight build reduces mechanical stress on PCB mounting pads
- RoHS-compliant materials meet international environmental standards
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-13 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Cooling medium-power MOSFETs in DC-DC converter designs
Thermal management of linear regulators on dense PCBs
Heat dissipation for gate driver ICs in motor controllers
Passive cooling of power op-amps in audio amplifier boards
Temperature control in compact industrial sensor modules
Frequently Asked Questions
How is the SRQ-HJ-13 attached to a PCB-mounted component?
The SRQ-HJ-13 can be attached using push-pin clips, M3 screws through the PCB, or thermally conductive adhesive tape. Clip mounting is preferred for field-replaceable assemblies, while screw mounting provides the most consistent clamping force and lowest contact resistance.
Is the SRQ-HJ-13 suitable for fanless embedded systems?
Yes. Its compact profile and optimized fin geometry make it well-suited for fanless embedded systems where passive cooling is required. Ensure adequate board-level airflow clearance around the fins to achieve rated thermal performance.
What power dissipation range does the SRQ-HJ-13 target?
The SRQ-HJ-13 is designed for medium-power applications, typically handling component dissipation in the range of 5–20 W under natural convection, depending on ambient temperature and mounting orientation. Consult the datasheet for derating curves at elevated ambient temperatures.
SRQ-HJ-13 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.