Industrial / Heat Sinks
SRQ-HJ-14
The SRQ-HJ-14 (SRQ-HJ-14) is an industrial heat sink with a robust fin-and-base construction tailored for high-reliability thermal management in harsh operating environments. Designed to mount on power semiconductors and driver ICs, it provides low thermal resistance and stable heat spreading across the base plate. The SRQ-HJ-14 is well suited for use in industrial inverters, welding equipment, and motor control units where sustained power dissipation is required.
Key Features
- Robust fin-and-base construction engineered for high-reliability industrial deployments
- Thick aluminum base plate provides structural rigidity and uniform heat spreading
- Parallel fin array optimized for low-impedance airflow in ducted enclosures
- Multiple mounting hole configurations support flexible system integration
- Suitable for long-lifecycle industrial equipment with minimal maintenance requirements
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-14 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Thermal management of power modules in industrial drives
Heat dissipation for high-current rectifier assemblies
Cooling of IGBT stacks in UPS and inverter systems
Thermal control in railway traction power electronics
Heat spreading for multi-device power converter stages
Frequently Asked Questions
How does the fin-and-base construction of the SRQ-HJ-14 benefit high-reliability applications?
The integrated fin-and-base design eliminates thermal interfaces between separate components, reducing long-term degradation risks. The robust construction resists vibration and mechanical shock, making it suitable for industrial environments where equipment must operate reliably over extended service intervals without thermal performance degradation.
Can the SRQ-HJ-14 accommodate multiple power devices simultaneously?
Yes. The wide base platform of the SRQ-HJ-14 can support multiple TO-247 or similar packages mounted side by side, enabling shared thermal management across multi-device power stages. Ensure total dissipation stays within the heat sink's rated capacity.
What is the recommended torque for mounting screws on the SRQ-HJ-14?
Mounting screw torque depends on the fastener size and device package specification. Typically, M3 screws are torqued to 0.5–0.6 N·m for TO-220 packages. Always follow the semiconductor manufacturer's mounting guidelines to avoid cracking the device package or distorting the heat sink base.
SRQ-HJ-14 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
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