Industrial / Heat Sinks
SRQ-HJ-21
The SRQ-HJ-21 (SRQ-HJ-21) is an industrial heat sink designed for direct attachment to high-power TO-247 and TO-3P packaged devices in industrial power electronics. Its precision-machined mounting surface ensures minimal contact thermal resistance, while the tall fin array provides substantial cooling capacity under natural convection. The SRQ-HJ-21 is a reliable thermal solution for industrial welding inverters, plasma cutters, and high-frequency power converters.
Key Features
- Direct-mount design compatible with TO-247 and TO-3P packages
- High thermal conductivity aluminum alloy construction for efficient heat transfer
- Pre-drilled mounting holes aligned to standard TO-247/TO-3P footprints
- Anodized surface finish enhances emissivity and corrosion resistance
- Compact form factor minimizes PCB real estate consumption
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-HJ-21 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-power IGBT and MOSFET thermal management
Industrial motor drive inverter cooling
Switching power supply output stage heat dissipation
Welding equipment power module cooling
UPS and power conditioning unit thermal control
Frequently Asked Questions
Which package types is the SRQ-HJ-21 compatible with?
The SRQ-HJ-21 is specifically designed for TO-247 and TO-3P package devices. The mounting hole pattern and base contact area are dimensioned to match these standard footprints, ensuring optimal thermal interface contact without additional hardware modification.
Is thermal interface material required when mounting the SRQ-HJ-21?
Yes, applying thermal interface material (TIM) such as thermal paste or a phase-change pad between the device and heat sink base is strongly recommended. This eliminates air gaps at the contact surface and significantly reduces junction-to-case thermal resistance.
Can the SRQ-HJ-21 be used in a forced-air cooling setup?
The SRQ-HJ-21 is optimized for natural convection but can also benefit from forced-air cooling. Adding airflow across the fins will reduce thermal resistance and increase the maximum dissipatable power, making it suitable for higher-load applications.
SRQ-HJ-21 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.