Industrial / Heat Sinks
SRQ-SLB-02
The SRQ-SLB-02 heat sink offers a compact fin array profile suited for space-constrained PCB and module mounting applications. Manufactured from high-purity aluminum alloy, it delivers effective passive cooling without requiring additional airflow. Typical applications include LED drivers, DC-DC converters, and embedded computing modules.
Key Features
- Compact fin array profile designed for space-constrained PCB mounting
- Low-profile geometry fits within tight board-level height restrictions
- Lightweight aluminum construction reduces mechanical stress on PCB pads
- Compatible with standard module and through-hole power device footprints
- Suitable for both vertical and horizontal PCB mounting orientations
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-02 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Space-constrained embedded power supply cooling
Compact industrial controller board thermal management
Low-profile DC-DC module heat dissipation
Consumer and industrial power adapter thermal control
Onboard voltage regulator and linear IC cooling
Frequently Asked Questions
What are the height constraints the SRQ-SLB-02 is designed for?
The SRQ-SLB-02 features a low-profile fin array specifically engineered for assemblies with strict vertical clearance requirements. It is ideal for enclosures or PCB stacks where standard-height heat sinks would cause interference with adjacent boards or housing covers.
Can the SRQ-SLB-02 handle high-power devices?
The SRQ-SLB-02 is optimized for low-to-medium power devices where space is the primary constraint. For high-power applications, a larger heat sink from the SRQ-SLB series with greater fin surface area would be more appropriate to maintain safe junction temperatures.
What mounting methods are supported by the SRQ-SLB-02?
The SRQ-SLB-02 supports PCB clip mounting and screw-down attachment depending on the target device package. Its compact base is compatible with standard module footprints, and adhesive thermal tape can also be used for lightweight, vibration-tolerant installations.
SRQ-SLB-02 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.