Industrial / Heat Sinks
SRQ-SLB-03
The SRQ-SLB-03 is a passive heat sink featuring a low-profile design optimized for surface-mounted power components. Its anodized finish enhances both corrosion resistance and radiative heat transfer efficiency. Well suited for use in telecommunications equipment, industrial inverters, and automation control boards.
Key Features
- Ultra-low-profile design optimized for surface-mounted power components
- Passive cooling with no moving parts ensures maintenance-free operation
- Thermally conductive base provides direct contact with SMD power packages
- Lightweight construction minimizes solder joint stress during thermal cycling
- Anodized finish improves surface emissivity for enhanced radiative cooling
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-03 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
SMD power MOSFET and driver IC thermal management
Surface-mount voltage regulator heat dissipation
Compact IoT gateway and edge device power cooling
Low-profile industrial sensor power stage cooling
Automotive-grade SMD component thermal control
Frequently Asked Questions
How is the SRQ-SLB-03 attached to surface-mounted components?
The SRQ-SLB-03 is typically attached using thermally conductive adhesive tape or epoxy applied to the component's exposed thermal pad. This method provides a secure bond without mechanical fasteners, which is critical for SMD components where drilling or clamping is not feasible.
Is the SRQ-SLB-03 suitable for reflow soldering processes?
The SRQ-SLB-03 is not designed for reflow soldering. It is intended for post-reflow attachment using thermal adhesive. Exposing the aluminum heat sink to reflow oven temperatures is unnecessary and may affect the anodized surface finish or adhesive bond integrity.
What is the typical power dissipation range for the SRQ-SLB-03?
Given its low-profile passive design, the SRQ-SLB-03 is best suited for components dissipating up to a few watts in still-air conditions. Exact capacity depends on ambient temperature and airflow. For higher dissipation, forced convection or a larger heat sink should be considered.
SRQ-SLB-03 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.