Industrial / Heat Sinks
SRQ-SLB-06-2
The SRQ-SLB-06-2 is a variant heat sink in the SRQ-SLB-06 series, offering a modified mounting configuration to accommodate alternative device footprints. Its extruded profile maintains consistent thermal performance across the fin array. Used in industrial automation, power conversion, and electronic load testing equipment.
Key Features
- Modified mounting configuration accommodates alternative device package layouts
- Shares fin geometry with SRQ-SLB-06-1 for consistent thermal performance
- Variant design enables drop-in replacement in revised PCB layouts
- Aluminum extrusion construction ensures dimensional consistency across batches
- Flexible mounting options support both vertical and horizontal device orientations
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-06-2 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Revised PCB layout power device thermal management
Alternative package footprint industrial cooling solutions
Half-bridge and full-bridge power stage heat dissipation
Industrial drive system power module cooling
Custom enclosure-constrained power electronics thermal control
Frequently Asked Questions
What distinguishes the SRQ-SLB-06-2 from the SRQ-SLB-06-1?
The SRQ-SLB-06-2 is a variant of the SRQ-SLB-06-1 with a modified mounting configuration. This allows it to fit different device package footprints or PCB layouts while retaining the same fin array and thermal dissipation characteristics as the original 06-1 model.
Can the SRQ-SLB-06-2 be used as a direct replacement for the SRQ-SLB-06-1?
Not necessarily. While the thermal performance is equivalent, the mounting hole pattern differs. Verify that the SRQ-SLB-06-2 mounting configuration matches your PCB and device package layout before substituting it for the 06-1 in an existing design.
Is the SRQ-SLB-06-2 available with custom hole patterns?
CZT offers customization options for industrial customers with specific mounting requirements. Contact the sales team with your device package dimensions and PCB layout to discuss whether a modified hole pattern or base geometry can be accommodated within standard lead times.
SRQ-SLB-06-2 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.