Industrial / Heat Sinks
SRQ-SLB-07
The SRQ-SLB-07 heat sink features an elongated base plate design that distributes heat evenly across multiple mounted components. Constructed from aluminum alloy with a natural or anodized surface finish, it supports both vertical and horizontal installation orientations. Ideal for multi-device power modules, UPS systems, and industrial relay boards.
Key Features
- Elongated base plate distributes heat evenly across multiple mounted components
- Extended footprint supports linear arrays of power devices on a single sink
- Uniform fin height and pitch maintain consistent thermal resistance along base
- Robust aluminum extrusion withstands mechanical stress from multi-device clamping
- Suitable for bus-bar style power assemblies requiring shared thermal management
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-07 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Multi-device power module arrays in industrial inverters
Three-phase bridge rectifier thermal management
Linear power transistor array heat dissipation
High-current bus-bar power assembly cooling
Multi-output industrial power supply thermal control
Frequently Asked Questions
How many devices can be mounted along the SRQ-SLB-07 base plate?
The number of devices depends on individual package dimensions and required spacing. The elongated base is designed to support a linear array of power components, making it suitable for three-phase bridge configurations or multi-channel power stages sharing a common thermal path.
Does heat spreading across the elongated base affect thermal performance?
Thermal spreading resistance is a consideration with elongated base designs. Devices mounted near the center of the base may experience slightly different thermal conditions than those at the ends. Thermal simulation or empirical testing is recommended to verify junction temperatures across all mounted devices.
What is the recommended mounting hardware for the SRQ-SLB-07?
M3 or M4 screws are typically used, with torque applied evenly across all mounting points to ensure uniform contact pressure. For multi-device installations, mount devices sequentially from the center outward to minimize base plate warping and ensure consistent thermal interface contact.
SRQ-SLB-07 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.