Industrial / Heat Sinks
SRQ-SLB-08
The SRQ-SLB-08 is a robust heat sink with a high fin-count profile engineered for applications requiring enhanced passive cooling capacity. Its precision-extruded aluminum body ensures consistent fin pitch and thermal contact quality. Designed for use in high-power amplifiers, industrial PLCs, and energy storage electronics.
Key Features
- High fin-count profile significantly increases convective surface area
- Engineered for applications requiring enhanced passive cooling capacity
- Robust aluminum construction supports demanding continuous-duty thermal loads
- Dense fin array optimized for low-to-medium velocity forced-air cooling
- Flat precision-machined base minimizes contact thermal resistance with devices
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-08 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-dissipation passive cooling in sealed industrial enclosures
Power amplifier and RF module thermal management
High-current rectifier and chopper circuit heat dissipation
Industrial UPS and energy storage converter cooling
Continuous-duty motor controller power stage thermal control
Frequently Asked Questions
What is the benefit of a high fin-count design in the SRQ-SLB-08?
A higher fin count increases total convective surface area within a given base footprint, reducing thermal resistance and allowing more heat to be dissipated passively. This is especially valuable in sealed or low-airflow enclosures where maximizing passive performance is critical.
Is the SRQ-SLB-08 suitable for use without forced airflow?
Yes, the SRQ-SLB-08 is engineered for enhanced passive cooling. However, the dense fin pitch means that natural convection airflow between fins may be limited. For best passive performance, ensure fins are vertically oriented and that the enclosure allows adequate thermal convection paths.
How does the SRQ-SLB-08 compare to lower fin-count models in the SRQ-SLB series?
The SRQ-SLB-08 offers lower thermal resistance than lower fin-count variants due to its greater surface area, making it suitable for higher power dissipation requirements. The trade-off is a slightly higher pressure drop in forced-air setups, which should be factored into fan selection.
SRQ-SLB-08 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.