Industrial / Heat Sinks
SRQ-SLB-09
The SRQ-SLB-09 heat sink combines a broad base footprint with a moderate fin height to balance thermal resistance and mechanical stability. The aluminum construction is compatible with standard thermal interface materials for optimized device contact. Applicable in motor controllers, solar inverters, and industrial power distribution equipment.
Key Features
- Broad base footprint maximizes contact area with power device mounting surface
- Moderate fin height balances thermal resistance against mechanical clearance constraints
- Extruded aluminum construction provides consistent cross-section and low thermal resistance
- Compatible with standard TO-220, TO-247, and similar through-hole package footprints
- Anodized surface finish improves emissivity for enhanced passive radiation cooling
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-SLB-09 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Motor drive inverter boards with space-limited heatsink envelopes
Industrial power supply regulation stages requiring passive cooling
PLC output modules dissipating moderate continuous power loads
Embedded control systems with low-profile thermal management requirements
Relay driver circuits mounted on DIN-rail control panels
Frequently Asked Questions
What is the typical thermal resistance of the SRQ-SLB-09?
Thermal resistance depends on fin geometry, airflow conditions, and mounting interface quality. For the SRQ-SLB-09's broad-base moderate-fin profile, natural convection Rth(s-a) typically falls in the 5–12°C/W range. Contact CZT for datasheet values and application-specific derating guidance.
Which power semiconductor packages are compatible with the SRQ-SLB-09?
The SRQ-SLB-09 base is dimensioned for common TO-220, TO-218, and TO-247 package footprints. Mounting holes align with standard bolt patterns. Verify hole spacing and base dimensions against your device's tab dimensions before finalizing the PCB layout.
Is thermal interface material required when mounting to the SRQ-SLB-09?
Yes. A thermal interface material — such as thermal paste or a phase-change pad — is strongly recommended to fill microscopic surface irregularities between the device tab and heatsink base. Omitting TIM can increase junction-to-sink thermal resistance by 2–5°C/W depending on surface finish.
SRQ-SLB-09 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.