Industrial / Heat Sinks
SRQ-XJ-02
The SRQ-XJ-02 heat sink builds on the XJ series design with an extended fin array for improved heat dissipation over the SRQ-XJ-01. The aluminum construction and compact form factor make it suitable for board-level integration in space-limited enclosures. Typical applications include industrial power adapters, lighting control systems, and embedded motor drivers.
Key Features
- Extended fin array delivers improved heat dissipation over the base XJ-01 design
- Increased fin surface area reduces thermal resistance under natural convection conditions
- Maintains XJ series base footprint for backward-compatible mounting with XJ-01 layouts
- Extruded aluminum with optimized fin pitch balances airflow resistance and surface area
- Suitable for higher power dissipation applications within the same PCB footprint
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-02 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Higher-power TO-247 IGBT cooling in industrial inverter stages
Upgraded thermal management in existing XJ-01 compatible PCB designs
Linear power supply pass transistor cooling requiring lower thermal resistance
Industrial motor controller output stage passive thermal management
Power amplifier output device cooling in audio and RF equipment
Frequently Asked Questions
How much does the extended fin array improve thermal resistance compared to the SRQ-XJ-01?
The extended fin array of the SRQ-XJ-02 increases effective surface area, typically reducing natural convection thermal resistance by 15–30% compared to the XJ-01, depending on fin height and pitch. Exact improvement values are available in the product datasheet. Contact CZT for comparative thermal characterization data.
Does the SRQ-XJ-02 fit the same PCB mounting holes as the SRQ-XJ-01?
Yes. The SRQ-XJ-02 retains the same base footprint and mounting hole pattern as the XJ-01, making it a direct mechanical upgrade. The extended fins increase overall height, so verify vertical clearance in your enclosure before substituting the XJ-02 into an existing XJ-01 design.
What is the maximum continuous power dissipation for the SRQ-XJ-02?
Maximum power dissipation depends on allowable heatsink-to-ambient temperature rise and the heatsink's thermal resistance under your specific airflow conditions. Using the datasheet Rth(s-a) value and your maximum ambient temperature, calculate the power budget as P = ΔT / Rth(s-a). Contact CZT for application-specific guidance.
SRQ-XJ-02 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.