Industrial / Heat Sinks
SRQ-XJ-03
The SRQ-XJ-03 is an industrial-grade heat sink designed for efficient thermal dissipation in high-density electronic assemblies. Its extruded aluminum construction provides a reliable thermal path for heat-generating components. Commonly used in power supplies, motor drives, and industrial control panels where consistent component temperatures are critical.
Key Features
- Industrial-grade construction rated for high-density electronic assembly environments
- Optimized fin geometry supports efficient thermal dissipation in tight component spacing
- Robust extrusion tolerances ensure consistent mounting contact across production batches
- Compatible with standard TO-package power semiconductors and module footprints
- Surface anodizing provides long-term corrosion resistance in harsh industrial settings
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-03 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
High-density power converter boards with closely spaced active components
Industrial automation controllers requiring reliable passive thermal management
Servo drive output stage cooling in compact enclosure designs
Embedded computing power regulation in harsh environment deployments
Multi-axis motion control systems with high component packing density
Frequently Asked Questions
How does the SRQ-XJ-03 perform in high-density assemblies with restricted airflow?
The SRQ-XJ-03 fin geometry is optimized for natural convection in restricted-airflow environments typical of high-density assemblies. Fin pitch is selected to avoid flow choking while maximizing surface area. For very restricted enclosures, thermal simulation is recommended to confirm adequate cooling margin under worst-case conditions.
What certifications or standards does the SRQ-XJ-03 comply with?
CZT manufactures the SRQ-XJ-03 to meet general industrial quality standards. Specific certifications such as RoHS compliance and material declarations are available upon request. For applications requiring UL, CE, or other regional certifications, contact CZT to confirm current compliance documentation availability.
Can the SRQ-XJ-03 be used with forced-air cooling to increase power handling?
Yes. Adding forced airflow across the SRQ-XJ-03 fin array significantly reduces thermal resistance, often by 40–60% at moderate air velocities of 1–2 m/s. This allows the same heatsink to handle substantially higher power dissipation without changing the PCB layout or mounting configuration.
SRQ-XJ-03 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.