Industrial / Heat Sinks
SRQ-XJ-04
The SRQ-XJ-04 heat sink offers a compact form factor suited for space-constrained PCB layouts requiring passive cooling. Manufactured from thermally conductive aluminum alloy, it mounts directly to semiconductor packages to reduce junction temperatures. Typical applications include embedded systems, LED drivers, and low-to-mid power converter modules.
Key Features
- Compact form factor designed specifically for space-constrained PCB layouts
- Passive cooling operation eliminates fan noise and mechanical failure risk
- Low-profile fin array fits within tight vertical clearance envelopes on populated boards
- Lightweight aluminum construction minimizes added mass on PCB-mounted components
- Standard mounting pattern compatible with common TO-220 and SOT-227 packages
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-04 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Space-constrained embedded system power regulation requiring passive heatsinking
Portable industrial instruments with limited internal thermal management volume
Low-to-mid power DC-DC converter output stage cooling on dense PCBs
IoT gateway and edge computing hardware power device thermal management
Handheld test equipment internal power component cooling
Frequently Asked Questions
What is the maximum power dissipation the SRQ-XJ-04 can handle passively?
Due to its compact form factor, the SRQ-XJ-04 is best suited for devices dissipating up to approximately 3–8W under natural convection, depending on ambient temperature and allowable device case temperature. For higher dissipation, consider the larger XJ-02 or XJ-03 variants or add localized forced airflow.
How is the SRQ-XJ-04 mounted to the PCB or device?
The SRQ-XJ-04 supports screw-mount attachment through the base, compatible with standard TO-220 mounting hole patterns. Clip-mount options may also be available. The low-profile design allows direct PCB mounting without requiring standoffs, keeping the assembly height minimal for tight enclosure fits.
Is the SRQ-XJ-04 suitable for reflow or wave soldering assembly processes?
The SRQ-XJ-04 is a mechanical heatsink component, not a soldered part. It is attached after soldering via screw or clip. If your process requires heatsink attachment before reflow, consult CZT regarding high-temperature anodizing and any adhesive thermal pad options compatible with reflow temperature profiles.
SRQ-XJ-04 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.