Industrial / Heat Sinks
SRQ-XJ-06
The SRQ-XJ-06 heat sink features a profile designed to accommodate standard TO-package power semiconductors, providing stable thermal management under continuous load. The anodized aluminum surface enhances emissivity for improved passive cooling performance. Frequently specified in rectifier assemblies, voltage regulators, and industrial switching circuits.
Key Features
- Profile dimensioned to match standard TO-package power semiconductor tab geometry
- Provides secure mechanical and thermal contact for TO-220, TO-218, and TO-247 devices
- Fin profile designed for efficient heat spreading from single-device mounting configurations
- Extruded aluminum construction with flat machined base for minimal contact resistance
- Compact design suitable for both PCB-mounted and chassis-mounted power device cooling
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-06 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
TO-220 and TO-247 power MOSFET cooling in switching converters
Linear voltage regulator heatsinking on industrial control boards
Rectifier diode thermal management in AC-DC power supplies
Bipolar power transistor cooling in analog and linear amplifier stages
Thyristor and SCR heatsinking in phase-control power circuits
Frequently Asked Questions
Which specific TO-package types is the SRQ-XJ-06 profile designed for?
The SRQ-XJ-06 profile is dimensioned for standard TO-220, TO-218, and TO-247 package families, which share similar tab widths and mounting hole patterns. Verify the specific tab dimensions and hole spacing of your device against the SRQ-XJ-06 dimensional drawing to confirm compatibility before ordering.
Does the SRQ-XJ-06 require an isolation pad for TO-package mounting?
Whether an isolation pad is required depends on your circuit design. If the device tab is at a live potential and the heatsink is grounded or shared with other devices, an isolation pad and insulating bushing are mandatory. If the tab is at ground potential and no other devices share the heatsink, direct mounting without isolation is acceptable.
What thermal resistance can be expected from the SRQ-XJ-06 under natural convection?
For a single TO-package device under natural convection, the SRQ-XJ-06 typically achieves Rth(s-a) in the range of 8–15°C/W depending on fin height and ambient airflow conditions. Adding a thermal interface material with low bulk resistance and ensuring proper mounting torque are the most effective ways to minimize total Rth(j-a).
SRQ-XJ-06 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.