Industrial / Heat Sinks
SRQ-XJ-07
The SRQ-XJ-07 is a medium-profile heat sink intended for through-hole and surface-mount power devices requiring reliable heat dissipation over extended operating cycles. Its uniform fin spacing promotes consistent airflow across the thermal surface. Suitable for use in servo drives, battery management systems, and power conditioning equipment.
Key Features
- Compatible with both through-hole and surface-mount power device packages
- Medium-profile fin array balances thermal performance and board clearance
- Extruded aluminum construction ensures consistent fin geometry and low thermal resistance
- Pre-drilled mounting holes align with standard TO-220 and TO-247 footprints
- Anodized surface finish improves emissivity for enhanced passive heat dissipation
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-07 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Linear voltage regulators in industrial power supply boards
Through-hole MOSFET cooling in motor drive circuits
SMD power transistor thermal management in inverter designs
DC-DC converter output stage component cooling
Embedded control board power section thermal relief
Frequently Asked Questions
What package types is the SRQ-XJ-07 compatible with?
The SRQ-XJ-07 is designed to accommodate common through-hole packages such as TO-220, TO-218, and TO-247, as well as surface-mount equivalents. Mounting hole spacing conforms to standard industry footprints, minimizing the need for custom PCB modifications.
Is thermal interface material included or required?
Thermal interface material is not pre-applied. For optimal junction-to-heatsink thermal resistance, CZT recommends using a phase-change pad or thermal compound rated at ≤0.5°C·cm²/W between the device and the heat sink base.
Can the SRQ-XJ-07 be used in forced-air cooling setups?
Yes. While the SRQ-XJ-07 is optimized for passive natural convection, its fin geometry also responds well to low-velocity forced airflow, further reducing thermal resistance and extending the usable power dissipation range.
SRQ-XJ-07 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
Related Products
Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.