Industrial / Heat Sinks
SRQ-XJ-10
The SRQ-XJ-10 heat sink provides a wider base footprint for mounting multiple power devices on a single thermal interface, simplifying thermal management in multi-component designs. Its extruded fin structure supports both natural and forced convection cooling configurations. Applicable in multi-phase inverters, charging systems, and distributed power architectures.
Key Features
- Wide base footprint enables co-mounting of multiple power devices on one thermal interface
- Uniform base thickness ensures consistent thermal spreading across the full mounting area
- Fin array geometry optimized for multi-device heat flux distribution
- Standard and custom hole patterns available for flexible multi-device PCB layouts
- Extruded aluminum construction supports high-volume manufacturing consistency
Key Specifications
- Product type: heat sink / thermal management component
- Application focus: optical transceiver, networking, power electronics, or industrial electronics thermal management
- Material: aluminum alloy reference; confirm final alloy, temper, and finish during RFQ
- Process note: confirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
- +3 more specs below
Request drawing: This product has local image and specification coverage. Ask sales to confirm the latest drawing revision before sampling or tooling review.
SRQ-XJ-10 Specifications
Product typeheat sink / thermal management component
Application focusoptical transceiver, networking, power electronics, or industrial electronics thermal management
Materialaluminum alloy reference; confirm final alloy, temper, and finish during RFQ
Process noteconfirm extrusion, die casting, CNC machining, skiving, bonding, or surface finishing from the customer drawing
Drawing statusRequest Drawing during RFQ; local PDF not available from the legacy archive
Asset statusOld-site product image available
RFQ checkconfirm dimensions, fin geometry, thermal interface, mounting method, surface finish, packaging, and drawing revision
Typical Applications
Multi-phase power converter output stage with co-mounted MOSFETs
Parallel rectifier diode arrays in high-current power supplies
Multi-device IGBT mounting in variable frequency drive modules
Shared thermal platform for power and sense resistor arrays
Co-mounted linear regulator banks in telecom power distribution
Frequently Asked Questions
How many devices can be mounted on the SRQ-XJ-10 simultaneously?
The number of devices depends on individual package dimensions and required mounting clearances. The wide base is typically configured for two to four TO-220 or TO-247 devices in parallel. CZT can provide custom hole patterns to match specific multi-device PCB layouts.
Does mounting multiple devices on one heat sink cause thermal interference?
Thermal spreading between co-mounted devices is inherent in shared heat sink designs. The SRQ-XJ-10's thick base reduces lateral thermal resistance, but designers should account for mutual heating effects when calculating worst-case junction temperatures, particularly under simultaneous full-load operation.
What is the base material and surface flatness specification?
The SRQ-XJ-10 is extruded from 6063-T5 aluminum alloy. The mounting surface is machined to ensure flatness within industry-standard tolerances, promoting consistent thermal interface contact across the full base area when used with appropriate thermal interface materials.
SRQ-XJ-10 Details
CategoryIndustrial
SubcategoryHeat Sinks
Naming TemplateProduct name from catalog
BrandCZT
OriginChina
Drawing StatusRequest drawing
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Need a Custom Solution?
CZT offers OEM/ODM services with flexible MOQ. Contact our engineering team for custom connector solutions.